化学镀镍技术近年来发展迅速，并且随着电子、航空、石油等领域中的越来越多的应用，化学镀镍技术会得到更进一步的发展。化学镀镍是镍盐和还原剂在溶液中发生氧化还原反应，在工件的表面沉积出Ni-P合金镀层，同时析出氢气。化学镀镍它除了可使工件获得良好的耐磨性和耐蚀性，同时还有可操作性强、镀层厚度均匀、化学稳定性好等优良性能。本文从化学镀镍的反应机理出发，通过改变镀液组成及成分，确定镀镍液的各组成及成分的对于镍磷层的沉积速度、耐蚀性、孔隙率、硬度等的影响。同时在试验中发现，镀层质量与镀前处理、施镀条件以及镀后处理有很大的关系。
通过试验，最终确定出最优配方。该配方工艺的镀速在12μm/h左右，硫酸铜点滴实验时间为101min，孔隙率为0.250个/，并对其形貌进行测试。在确定最优配方后，对镀液的装载量，镀液的使用寿命和镀液的维护进行研究，使其能够在工业中生产。
Electroless nickel plating technology has developed rapidly in recent years, and with the electronics, aerospace, oil and other areas more and more applications, electroless nickel plating technology will be further developed. Electroless nickel plating is a nickel salt and a reducing agent in a solution oxidation-reduction reaction, deposited on the surface of the workpiece of Ni-P alloy coating, and simultaneous deposition of hydrogen. Electroless nickel plating workpiece can get in addition to its good wear and corrosion resistance, as well as strong operability, coating thickness uniformity, good chemical stability and excellent performance. In this paper, the reaction mechanism of electroless nickel plating starting by changing the bath composition and the composition of the nickel plating to determine the composition and ingredients for nickel-phosphorus layer deposition rate, corrosion resistance, porosity, hardness, and other effects. Meanwhile in the trial found that the coating quality and pre-plating treatment, plating and after plating processing conditions have a great relationship.
Through testing, and ultimately determine the optimal formula. The formulation process of the plating rate at 12μm / h or so, copper sulfate drip experiment time was 101min, porosity 0.250 /, and its morphology tests. In determining the optimal formula, the amount of load of the bath, the bath life and bath maintenance study, it can be produced in industry.
来自谷歌翻译器册衡。话说这玩意的中翻英质量漏指还算可以。。我的本科论文摘要就找这玩意翻返姿配译的
Chemical nickel plating technology develops rapidly in recent years, and with the application of more and more fields of electronics, aviation, petroleum, chemical nickel plating technology will be developed further. Chemical plating nickel salt and the reducing agent in the solution of the redox reaction occurs, the Ni-P alloy coating was deposited on the surface of workpiece, and hydrogen gas. Chemical nickel plating it except the workpiece can be wear resistance and good corrosion resistance, good performance and strong operability, coating thickness, good chemical stability and so. This paper from the reaction mechanism of chemical nickel plating, by changing the bath composition and composition, to determine the influence of velocity, deposition of Ni-P Layer nickel plating solution for the composition and corrosion resistance, porosity, hardness etc.. Also found in the experiment, the quality of coating and plating pretreatment, plating and post-plating process has the very big relations.
Through the test, and ultimately determine the optimal formula. The formulation of the plating rate is about 12 μ m/h, copper sulfate drop experiment time is 101min, the porosity is 0.250 /, and test its morphology. The optimal formula of plating solution, loading capacity, the life of the plating solution and the bath maintenance were studied, which can be produced in industry
中译英的化学论文可以找清北
医学翻译，总体不错，价格郑橘郑也低，服务也喊颂广，各种领域的都可以翻译，有化学，医学，农学等伍清等。